The healthcare industry’s transition toward single-use endoscope systems gained momentum in 2013 when the CDC issued warnings about multidrug-resistant bacteria linked to duodenoscopes. This prompted the FDA to champion the adoption of disposable endoscope architecture as a critical strategy for minimizing cross-contamination risks, addressing longstanding infection control challenges associated with reusable medical devices.
The response from leading endoscopy manufacturers has been swift and comprehensive. Boston Scientific’s EXALT™ Model D represents its single-use duodenoscope solution, while Ambu has developed an extensive range of disposable bronchoscopes and cystoscopes. Olympus contributed to this movement with its H-SteriScope™ series, expanding the single-use endoscopy market. Today’s medical professionals can choose from disposable versions of virtually every common endoscopic instrument: bronchoscopes, duodenoscopes, cystoscopes, uretroscopes, gastroscopes, colonoscopes, and rhinoscopes.
Moshe Doron – SVP Business Development, Valens Semiconductor
While disposable endoscopes now dominate the market in terms of units sold, clinical adoption tells a different story. Approximately 85-90% of endoscopic procedures continue to rely on reusable equipment, largely because these traditional devices still deliver superior performance and imaging capabilities at a relevant cost. Safety improvements alone cannot drive widespread adoption; disposable alternatives must match the performance standards of reusable systems while maintaining cost-effectiveness and operational simplicity.
In the past, technical limitations once prevented disposable endoscopes from achieving comparable performance to their reusable counterparts. Today’s technological landscape has shifted dramatically, making equivalent video performance levels attainable in disposable formats. The current obstacle centers on cost-effective scalability rather than technical feasibility. DSP-based connectivity solutions, combined with specialized semiconductors that minimize size while streamlining disposable-side serializer architecture, offer a promising pathway forward.
Balancing Performance Excellence with Disposable Economics
Cost considerations impose significant constraints on disposable scope design, restricting the range of available materials and components. Simultaneously, the demand for enhanced video resolution and improved frame rates necessitates high-speed digital data transmission from the camera’s distal tip. Engineers have addressed size and cost requirements by implementing long, thin copper cables, but this approach introduces new challenges. These narrower conductors inherently increase signal attenuation, leading to progressive signal quality degradation across transmission distances. Rising data transmission requirements compound these signal integrity issues, making it increasingly difficult to preserve optimal image quality.
The electromagnetic environment surrounding endoscopic procedures presents additional technical hurdles. Interference sources include wireless telemetry systems, adjacent monitoring equipment, and particularly problematic cautery machines. Conventional shielding and grounding approaches provide inadequate protection against high-intensity electromagnetic interference, especially the powerful noise generated by electrosurgical generators (ESG). Even if traditional shielding methods proved effective, the resulting increases in weight, cost, and physical bulk would contradict fundamental disposable device design principles. The solution requires a digital approach to interference management that maintains high performance standards while respecting the size and cost limitations inherent to disposable medical devices.
DSP-Based Connectivity: A Game-Changing Approach
Rather than attempting to prevent electromagnetic interference through physical barriers, DSP technologies provide active, real-time correction at the semiconductor level. MIPI A-PHY exemplifies this approach; a connectivity standard that originated in automotive camera applications and now brings transformative capabilities to medical device engineering.
MIPI A-PHY enables the convergence of high-resolution video streams, control signals, and power through a single, lightweight cable connection. This consolidation approach reduces device cost, physical dimensions, and overall weight while preserving excellent image quality and maintaining real-time system responsiveness.
The medical device industry benefits from several key DSP-based connectivity advantages:
- Superior electromagnetic resilience – MIPI A-PHY-based semiconductors incorporate advanced error correction through PHY-level dynamic retransmission capabilities that effectively neutralize external electromagnetic interference. This ensures consistent, error-free data transmission, addressing video reliability issues that have historically frustrated surgical teams during endoscopic procedures. The technology also delivers pristine, uncompressed video data that enables AI-powered computer-aided detection systems to perform accurate real-time analysis for identifying potential clinical abnormalities.
- Manufacturing process optimization –MIPI A-PHY’s ability to operate over multiple inline connectors enables the manufacturing of modular device architectures. This modularity allows the production of disposable components independently before final assembly during later production stages. The outcome is accelerated, scalable manufacturing processes with reduced complexity and lower overall costs.
- High-resolution video over cost-optimized channels – MIPI A-PHY-based chipsets facilitate high-speed video data transmission, achieving rates up to 8 Gbps for high-resolution video (4K@60fps and higher). It can do this over cabling as thin as 36AWG cabling across distances extending 7-10 meters or beyond.
Integrating the Technology Ecosystem
The evolution toward disposable endoscopy extends beyond infection prevention objectives. This transformation focuses on democratizing access to high-performance imaging capabilities while improving procedural consistency and system scalability. CMOS image sensor technology provides the foundation for developing more compact and intelligent medical devices. However, without equally efficient, cost-effective, and reliable digital connectivity infrastructure, these advanced imaging capabilities cannot reach their full clinical potential.
DSP-based connectivity solutions, exemplified by MIPI A-PHY technology, provide the critical missing component. Through cable simplification, electromagnetic interference mitigation, and modular design enablement, these technologies are enabling the deployment of disposable endoscopes at scale.
Byline: Moshe Doron – Senior Vice President of Business Development, Valens Semiconductor
With more than 25 years of experience in product, business development, management, design, and system architecture in a range of sectors, Moshe Doron is responsible for broadening Valens Semiconductors‘ business opportunities and leading strategic partnerships. Working closely with the company’s ecosystem of customers, strategic partners and management, he ensures the development of the best solutions for our customers. Previously, Moshe has held R&D, management, and executive positions at Zoran/CSR (acquired by Qualcomm), Heptagon (acquired by AMS), Oryx Vision and Ambarella. He holds an MBA from the Tel Aviv University and a B.Sc. in Electrical Engineering from the Technion Institute of Technology.
